Power Management - Specialized

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Applications Current - Supply Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
MC33PF8200DBESR2

MC33PF8200DBESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

2,374 -
RFQ
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200EMESR2

MC33PF8200EMESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

2,245 -
RFQ
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ETESR2

MC33PF8200ETESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

3,104 -
RFQ
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200A0ESR2

MC33PF8200A0ESR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

3,784 -
RFQ
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DNESR2

MC33PF8200DNESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,610 -
RFQ
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DMESR2

MC33PF8200DMESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

2,699 -
RFQ
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DFESR2

MC33PF8200DFESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

2,666 -
RFQ
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DHESR2

MC33PF8200DHESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,231 -
RFQ
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ESESR2

MC33PF8200ESESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,160 -
RFQ
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200CXESR2

MC33PF8200CXESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

3,107 -
RFQ
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
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