RFI and EMI - Contacts, Fingerstock and Gaskets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
0077001417

0077001417

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

1,233 -
RFQ
Datasheet 77 Bulk Active Fingerstock - 0.600" (15.24mm) 24.000" (609.60mm) 0.220" (5.59mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
0077001419

0077001419

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

3,502 -
RFQ
Datasheet 77 Bulk Active Fingerstock - 0.600" (15.24mm) 24.000" (609.60mm) 0.220" (5.59mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
0097056417

0097056417

RFI FINGERSTOCK BECU TIN CLIP

Laird Technologies EMI

4,545 -
RFQ
Datasheet Clip-On Twist Bulk Active Fingerstock - 0.210" (5.33mm) 16.000" (406.40mm) 0.140" (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip 121°C
0098054102

0098054102

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

3,297 -
RFQ
Datasheet Ultrasoft Foldover Bulk Active Fingerstock - 0.380" (9.65mm) 16.000" (406.40mm) 0.120" (3.05mm) Beryllium Copper - - Adhesive 121°C
0098095417

0098095417

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

1,851 -
RFQ
Datasheet Ultrasoft Symmetrical (S3) Slotted Bulk Active Fingerstock - 0.450" (11.43mm) 15.000" (381.00mm) 0.140" (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
4208PA51G07200

4208PA51G07200

RFI FOF GASKET ADH

Laird Technologies EMI

2,362 -
RFQ
Datasheet 51G Bulk Active Fabric Over Foam Rectangle 0.394" (10.00mm) 72.000" (182.88cm) 1.000" (25.40mm) - - - Adhesive -
8516-0120-72

8516-0120-72

RFI GASKET

Laird Technologies EMI

1,260 -
RFQ
Datasheet Electroseal™ Bulk Active Gasket - 1.031" (26.19mm) - - - - - - -
0097055919

0097055919

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

2,214 -
RFQ
Datasheet Twist Bulk Active Fingerstock - 0.300" (7.62mm) 24.000" (609.60mm) 0.070" (1.78mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
387012273

387012273

UFR,BECU,SBNI,RL 0.5

Laird Technologies EMI

3,811 -
RFQ
Datasheet Ultraflex Bulk Active - - - - - - - - - -
0C98044002

0C98044002

RFI FINGERSTOCK BECU UNPLAT ADH

Laird Technologies EMI

3,182 -
RFQ
Datasheet Ultrasoft Large Enclosure Bulk Active Fingerstock - 1.630" (41.40mm) 25.00' (7.60m) 0.410" (10.41mm) Beryllium Copper Unplated - Adhesive 121°C
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