Intel

AGFA027R31C2E1VB

IC FPGA AGILEX-F 3184BGA

Part No.:
AGFA027R31C2E1VB
Manufacturer:
Intel
Category:
System On Chip (SoC)
Package:
3184-BFBGA Exposed Pad
Datasheet:
AGFA027R31C2E1VB.pdf
Description:
IC FPGA AGILEX-F 3184BGA
Quantity:
Original Supply

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AGFA027R31C2E1VB Technical Information

  • Specifications
  • FAQ
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  • Product Substitutes

Specifications

Product Attributes
Attribute Value
Manufacturer:
Intel
Series:
Agilex F
Package/Case:
3184-BFBGA Exposed Pad
Packaging:
Tray
Product Status:
Active
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.7M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
3184-BGA (56x45)

FAQ

1. How to order AGFA027R31C2E1VB on FU JIA (H.K) Electronics?

You can submit an RFQ directly on this page. Our sales team will review your quantity, delivery requirements and target price, then reply with a quotation as soon as possible.

2. How does FU JIA (H.K) Electronics verify the quality of AGFA027R31C2E1VB?

We work with qualified suppliers and conduct strict supplier review and product verification. Our team pays close attention to sourcing channels, traceability and product condition.

3. Are the price and inventory of AGFA027R31C2E1VB updated in real time?

Inventory and prices of electronic components may fluctuate frequently. The displayed data is for reference, and the final quotation will be confirmed by our sales team.

4. What payment methods are accepted?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and region.

5. How is shipping arranged?

We can arrange international shipping through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for AGFA027R31C2E1VB?

Please contact our sales team within the specified period if there are quantity differences, wrong items, or clear external defects. The product should remain unused and in its original packaging.

7. Can I request technical support for AGFA027R31C2E1VB?

Yes. You can contact us for datasheet, package details, pin information and sourcing assistance related to AGFA027R31C2E1VB.

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Product Substitutes

No substitute products are available for AGFA027R31C2E1VB at the moment. Please contact us for alternative part recommendations.

AGFA027R31C2E1VB Sourcing & Technical Support

AGFA027R31C2E1VB is supplied by Intel. This product page provides key purchasing information including manufacturer, package, datasheet, stock reference, price reference and RFQ support.

As a professional electronic components sourcing supplier, FU JIA (H.K) Electronics helps customers source AGFA027R31C2E1VB and related semiconductor components for prototype development, maintenance, production preparation and BOM procurement.

If you need the latest price, available inventory, lead time, alternative parts, datasheet, package confirmation or batch information for AGFA027R31C2E1VB, please submit an RFQ and our sales team will provide quotation and sourcing support.

Part Number
AGFA027R31C2E1VB
Manufacturer
Intel
Package
3184-BFBGA Exposed Pad
Category
System On Chip (SoC)

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