FU JIA (H.K)

GD55B02GF

Part No.:
GD55B02GF
Manufacturer:
FU JIA (H.K)
Category:
Industrial-Grade SPI NOR Flash Product Selection
Package:
SOP16 300mil,TFBGA24 5x5 ball array
Datasheet:
GD55B02GF.pdf
Description:
Quantity:
Original Supply

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Datasheet Support

Help engineers quickly verify product specifications.

BOM Sourcing

Support multi-part procurement and RFQ matching.

GD55B02GF Technical Information

  • Specifications
  • FAQ
  • Hot Sale
  • Related Products
  • Product Substitutes

Specifications

Product Attributes
Attribute Value
Manufacturer:
FU JIA (H.K)
Package/Case:
SOP16 300mil,TFBGA24 5x5 ball array
Series:
Packaging:
Product type:
Status:
MP
Voltage:
3V
Capacity:
2Gb
Temperature (Industrial Standard):
-40℃~85℃,-40℃~105℃,-40℃~125℃
Frequency (MHz):
133(x1 x2 x4)
Key Features:
Default 4I/O,H/W RESET,WP#,Secured OTP,Suspend
Pin To Pin Reference Winbond:
W25N02GEZEIG

FAQ

1. How to order GD55B02GF on FU JIA (H.K) Electronics?

You can submit an RFQ directly on this page. Our sales team will review your quantity, delivery requirements and target price, then reply with a quotation as soon as possible.

2. How does FU JIA (H.K) Electronics verify the quality of GD55B02GF?

We work with qualified suppliers and conduct strict supplier review and product verification. Our team pays close attention to sourcing channels, traceability and product condition.

3. Are the price and inventory of GD55B02GF updated in real time?

Inventory and prices of electronic components may fluctuate frequently. The displayed data is for reference, and the final quotation will be confirmed by our sales team.

4. What payment methods are accepted?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and region.

5. How is shipping arranged?

We can arrange international shipping through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for GD55B02GF?

Please contact our sales team within the specified period if there are quantity differences, wrong items, or clear external defects. The product should remain unused and in its original packaging.

7. Can I request technical support for GD55B02GF?

Yes. You can contact us for datasheet, package details, pin information and sourcing assistance related to GD55B02GF.

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Product Substitutes

W25N02GEZEIG Winbond

W25N02GEZEIG

Winbond

GD55B02GF Sourcing & Technical Support

GD55B02GF is supplied by FU JIA (H.K). This product page provides key purchasing information including manufacturer, package, datasheet, stock reference, price reference and RFQ support.

As a professional electronic components sourcing supplier, FU JIA (H.K) Electronics helps customers source GD55B02GF and related semiconductor components for prototype development, maintenance, production preparation and BOM procurement.

If you need the latest price, available inventory, lead time, alternative parts, datasheet, package confirmation or batch information for GD55B02GF, please submit an RFQ and our sales team will provide quotation and sourcing support.

Part Number
GD55B02GF
Manufacturer
FU JIA (H.K)
Package
SOP16 300mil,TFBGA24 5x5 ball array
Category
Industrial-Grade SPI NOR Flash Product Selection

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